Azimuth Electronics Inc. Test and Burn-in Sockets

Leadless Chip Carrier

Leadless Chip Carrier: Dual Flat Pack (No Leads), Leadless Chip Carrier, Leadless Metric, Ceramic Leadless Chip Carrier, Quad Flat (No Leads), Micro Lead Frame, Thin QFN (No Leads), Stack Flatpack, Dual Lead-Less Chip Carrier, Monolithic Microwave Integrated Circuit, Low Temperature Co-fired Ceramic, High Temperature Co-fired Ceramic
Lead Count
Pitch [mm]
No. of Sides
Pad per Side
Package Size
Catalog Data Sheet Azimuth Part No.
6
0.047 [1.19]
2
3
0.330 [8.38] x 0.390 [9.91]
6
0.047 [1.19]
2
3
0.324 [8.23] x 0.386 [9.80]
9
0.039 [1.00]
2
4 / 5
0 .159 [4.04] x 0.215 [5.46]
16
0.035 [0.89]
2
8
0.464 [11.79] x 0.728 [18.49]
16
0.050 [1.27]
4
4
0.308 [7.82]  Sq.
18
0.050 [1.27]
4
3 / 6
0.270 [6.86]  Sq.
20
0.050 [1.27]
4
5
0.358 [9.09]  Sq.
24
0.100 [2.54]
2
12
0.790 [20.07] x 1.330 [33.78]
28
0.040 [1.02]
4
7
0.405 [10.29]  Sq.
28
0.050 [1.27]
4
7
0.500 [12.70]  Sq.
32
0.050 [1.27]
2
16
0.510 [12.95] x 0.825 [20.96]
36
0.035 [0.89]
4
9
0.355 [9.02]  Sq.
40
0.035 [0.89]
4
10
0.410 [10.41]  Sq.
40
0.040 [1.02]
4
9 / 11
0.400 [10.16]  Sq.
40
0.050 [1.27]
4
7 / 13
0.560 [14.22] x 0.750 [19.05]
44
0.025 [0.64]
4
11
0.500 [12.70]  Sq.
48
0.035 [0.89]
4
12
0.460 [11.68]  Sq.
48
0.050 [1.27]
2
24
0.730 [18.54] x 1.200 [30.48]
54
0.031 [0.80]
2
27
0.403 [10.24] x 0.875 [22.22]
56
0.035 [0.89]
4
13 / 15
0.528 [13.41]  Sq.
66
0.026 [0.65]
2
33
0.400 [10.16] x 0.880 [22.35]
84
0.040 [1.02]
4
21
1.200 [30.48]  Sq.
136
.0354 [0.90] / var
4
31 x 33 x 31 x 41
1.240 [31.50] x 1.390 [35.30]
180
0.040 [1.02]
4
45
2.000 [50.80]  Sq.
840
0.050 [1.27]
4
133 / 287
2.145 [54.48] x 4.145 [105.28]
N
N
4
N
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